3D IC Integration and Packaging (Electronics) - download pdf or read online

By John H. Lau

A accomplished consultant to 3D IC integration and packaging technology

3D IC Integration and Packaging absolutely explains the most recent microelectronics ideas for expanding chip density and maximizing functionality whereas decreasing strength intake. in accordance with a direction built by way of its writer, this useful consultant bargains real-world problem-solving tools and teaches the trade-offs inherent in making system-level judgements. discover key allowing applied sciences comparable to TSV, thin-wafer power dimension and dealing with, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor photo sensors integration. meeting, thermal administration, and reliability are coated in whole detail.
3D IC Integration and Packaging covers:
3D integration for semiconductor IC packaging
Through-silicon vias modeling and testing
Stress sensors for thin-wafer dealing with and power measurement
Package substrate technologies
Microbump fabrication, meeting, and reliability
3D Si integration
2.5D/3D IC integration
3D IC integration with passive interposer
Thermal administration of 2.5D/3D IC integration
Embedded 3D hybrid integration
3D LED and IC integration
3D MEMS and IC integration
3D CMOS picture sensors and IC integration
PoP, chip-to-chip interconnects, and embedded fan-out WLP

Show description

Read Online or Download 3D IC Integration and Packaging (Electronics) PDF

Best electrical engineering books

Integrated Circuit, Hybrid, and Multichip Module Package - download pdf or read online

Circuit designers, packaging engineers, published board fabricators, and procurement body of workers will locate this book's microelectronic package deal design-for-reliability instructions and methods crucial for reaching their life-cycle, cost-effectiveness, and on-time supply ambitions. Its uniquely equipped, time-phased method of layout, improvement, qualification, manufacture, and in-service administration exhibits you step by step how you can: * outline real looking approach specifications by way of venture profile, working existence, functionality expectancies, dimension, weight, and value * outline the procedure utilization setting in order that all working, delivery, and garage stipulations, together with electric, thermal, radiation, and mechanical lots, are assessed utilizing life like facts * determine power failure modes, websites, mechanisms, and architecture-stress interactions--PLUS applicable measures you could take to lessen, put off, or accommodate anticipated disasters * symbolize fabrics and methods by way of the most important controllable elements, equivalent to forms and degrees of defects, adaptations in fabric homes and dimensions, and the producing and meeting procedures concerned * Use scan, step-stress, and sped up how you can confirm optimal layout prior to construction starts off targeted layout instructions for substrate.

Get Programming the PIC Microcontroller with MBASIC (Embedded PDF

The Microchip PIC relatives of microcontrollers is the most well-liked sequence of microcontrollers on the earth. despite the fact that, no microcontroller is of any use with out software program to make it practice beneficial capabilities. This entire reference specializes in designing with Microchip’s mid-range PIC line utilizing MBASIC, a robust yet effortless to benefit programming language.

Download e-book for iPad: Energie sparen: Die LED-Tube im Vergleich zur by Andreas Bohn

Bachelorarbeit aus dem Jahr 2011 im Fachbereich Elektrotechnik, word: intestine, Fachhochschule des bfi Wien GmbH, Sprache: Deutsch, summary: Zu Zeiten des ökologischen und ökonomischen Umdenkens wird kontinuierlich nach effizienten und umsetzbaren Energiesparmaßnahmen gesucht. Der Bereich der Beleuchtungstechnik bietet hier ausbaufähige Potenziale, da noch heute ein ansehnlicher Anteil des Gesamtvolumens der aufgewendeten Energien in diesem Sektor verbraucht wird.

New PDF release: GNSS Markets and Applications (GNSS Technology and

Such a lot identified for GPS items, the worldwide navigation satellite tv for pc structures (GNSS) is poised for dramatic progress. Many GNSS company specialists are predicting ten-fold development over the subsequent decade to make GNSS a $300-billion undefined. This e-book offers an in depth, exact photograph of the present GNSS industry, supplying prepared perception into destiny developments.

Extra resources for 3D IC Integration and Packaging (Electronics)

Sample text

Download PDF sample

3D IC Integration and Packaging (Electronics) by John H. Lau

by John

Rated 4.52 of 5 – based on 49 votes